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  • RPI SCOREC - Technical Reports
    the robustness and computational efficiency of a modeling environment It allows accurate modeling computation for models defined in a different modeler using different tolerance schemes For example importing a very simple model defined in a modeler using a tolerance of results in the definition of an invalid model with gaps near the boundary of model faces Although tolerant modeling practice eliminates extremely small geometric features from the definition of a

    Original URL path: http://www.scorec.rpi.edu/reports/view_report.php?id=248 (2015-07-15)
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  • RPI SCOREC - Technical Reports
    introduced at adaptive enrichment steps during the course of a parallel computation We develop and describe three procedures for retaining and restoring load balance that have low unit cost and are appropriate for use in an adaptive solution environment Tiling balances loading by using local optimality criteria within overlapping processor neighborhoods Elemental data are migrated between processors within the same neighborhoods to restore balance Tiling can potentially be improved by

    Original URL path: http://www.scorec.rpi.edu/reports/view_report.php?id=249 (2015-07-15)
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  • RPI SCOREC - Technical Reports
    euclidean space of the model The mapping determines the position vector X and derivatives of X with respect to upto the required order The accuracy of the finite element solution depends upon the accuracy of the geometric mapping of the finite elements This dependency is more significant in the p version of the finite element method where the finite element meshes are typically coarse 1 The standard technique for mapping

    Original URL path: http://www.scorec.rpi.edu/reports/view_report.php?id=250 (2015-07-15)
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  • RPI SCOREC - Technical Reports
    thermal and thermo mechanical analysis of multilayer multichip modules MCM s The need to explicitly consider the two physical scales of the MCM the global scale and the neighborhood of critical areas with features discretely represented the local scale dictated that new analysis methodologies be developed To address this development effort a three task project was performed The goal of the first task was the development and seamless integration of

    Original URL path: http://www.scorec.rpi.edu/reports/view_report.php?id=251 (2015-07-15)
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  • RPI SCOREC - Technical Reports
    User s Manual Year 1994 Abstract The Rensselaer Electronic Packaging Analysis Software REPAS is a seamlessly integrated system of global local thermal and thermomechanical analysis procedures for MCM s with an interface to an electromagnetic analysis capability Starting from the common description of the MCM in the Caltech Intermediate Format CIF and analysis attribute information specified in a flexible format the thermal and thermomechanical analysis procedures are automatically executed These

    Original URL path: http://www.scorec.rpi.edu/reports/view_report.php?id=252 (2015-07-15)
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  • RPI SCOREC - Technical Reports
    Garimella R B Iverson Y L Le Coz B J Lwo T L Sham M S Shephard L Y Song and V S Wong Title REPAS Rensselaer Electronic Packaging Analysis Software Programmer s Manual Year 1994 Abstract The analysis of MCM s requires a system of carefully coordinated software to perform thermal thermomechanical and electromagnetic analyses The Rensselaer Electronic Packaging Analysis Software REPAS is a seamlessly integrated system of thermal

    Original URL path: http://www.scorec.rpi.edu/reports/view_report.php?id=253 (2015-07-15)
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  • RPI SCOREC - Technical Reports
    Computers Year 1994 Pages Editor Abstract A parallel adaptive implicit finite element method for the analysis of steady and unsteady compressible flows on distributed memory computers is presented in this work The methodology developed here relies on domain decomposition techniques for efficiently exploiting data locality parallel finite element solution strategies for large scale problems adaptive mesh strategies for refining and derefining the discretization mesh migration techniques for reducing the load

    Original URL path: http://www.scorec.rpi.edu/reports/view_report.php?id=254 (2015-07-15)
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  • RPI SCOREC - Technical Reports
    molecular surface reactions liberate Si which when absorbed into the preform reacts with Mo to form a molybdenum di silicide matrix As a first step in modeling the RVI process we present a mathematical model of the diffusion of Si into a compressed powder Mo pellet to form the matrix The production of an intermediate silicide layer the growth of the layer and the volume expansion of the pellet are

    Original URL path: http://www.scorec.rpi.edu/reports/view_report.php?id=255 (2015-07-15)
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